Advances in Chemical Mechanical Planarization (Cmp)

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications.

This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes, and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with Tungsten, Cobalt, and Ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices.

Part Two addresses consumables and process control for improved CMP, and includes chapters on diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. The second edition includes coverage of post-CMP cleaning challenges and tribology of CMP.