Boyd (374324B00035G) Heat Sink, Square, PCB, 30.6 °C/W
For Ball Grid Arrays, BGA, 27 mm, 10 mm, 27 mm
Takealot · checked Today
- Average
- R 1 036.00
- Lowest seen
- R 888.00
- Highest seen
- R 1 036.00
- Last change
- -R 148.00
- First indexed
- 28 Sep 2026
- Retailer
- Takealot
Description
Heat Sink, Square, PCB, For Ball Grid Arrays, 30.6 °C/W, BGA, 27 mm, 10 mm, 27 mm
Product Information
Thermal Resistance: 30.6°C/W
Packages Cooled: BGA
External Width - Metric: 27mm
External Height - Metric: 10mm
External Length - Metric: 27mm
Heat Sink Material: Aluminium
External Width - Imperial: 1.06"
External Height - Imperial: 0.39"
External Length - Imperial: 1.06"
Product Overview
Tape mounting saves board space by eliminating mounting holes
Convenient peel and stick assembly is quick and clean
Pin-Fin array allows omni-directional airflow to maximize heat dissipation
Fin dimensions (LxW): 13x12mm
What's in the box
1 x Heat Sink
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