RELIFE F-23 218 BGA No-Clean Soldering Flux – Paste for PCB & Electronics Repair 2 Pack

Suitable for welding and ball planting of computer north and south bridges, graphics cards, mobile phone chips, video game chips, etc. Easy to solder, easy to clear, no irritating odor, environmentally friendly solder resist rosin. Good tinning property, high insulation resistance, easy to tin. Quickly remove the oxide film on the welding surface, easy to weld, and prevents oxidation.