Wafer Bonding (Hardback)
Alexe, M. (EDT)/ Gosele, U. (EDT)
R 10 558.00
Takealot ยท checked 5 days ago
- Average
- R 10 428.30
- Lowest seen
- R 10 278.00
- Highest seen
- R 10 615.00
- Last change
- R 280.00
- First indexed
- 22 Sep 2026
- Retailer
- Takealot
Description
The topics of this title include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.